TE Connectivity mixed media platform

The mixed media platform is designed to support a mixed copper and fibre infrastructure in data centres. Users save space and money by mixing copper and fibre within a single panel and take advantage of free space alongside, above and below the 19” envelope.

It consists of two product concepts: the universal connectivity platform (UCP) and the NETpodium rack system. The UCP is designed to deliver maximum rack efficiency and multiple media deployment. It includes a range of components that include patch panels, subfloor panel and overhead panel mounts, preterminated links and adaptor modules. One common patch panel, either angled or flat, is used to accommodate both copper and fibre, and the units can be installed within or outside the 19″ envelope. The NETpodium rack system complements the UCP both inside and outside of the 19″ envelope while maintaining the electrical and mechanical integrity of the channel. High-density cable managers incorporate corner brackets and fingers in a single unit and provide bend radius control for both copper and fibre and patch cable support in high-density environments. They also ensure cable containment and prevent the accidental disturbance or removal of patch cords.

A tool-less fastener enables rapid installation, allowing all accessories to be fixed in three steps: insert, position and lock. The rack system’s aluminium profile allows installers to mount accessories wherever they are required, simply by adjusting the positioning of the fastener along the T-channel.